研究方向：数字芯片电子设计自动化、系统工艺协同优化、人工智能

        电子邮箱： zhiangwang@fudan.edu.cn

简要介绍

        王志昂，复旦大学集成芯片与系统全国重点实验室助理教授，入选国家海外高层次青年人才计划和上海市海外高层次青年人才计划。研究方向为数字集成电路设计自动化与系统工艺协同优化，聚焦异构计算、人工智能与芯片物理设计交叉领域，主要从事开源物理设计全流程工具OpenROAD的研究与开发。2019年本科毕业于中国科学技术大学应用物理学专业，2024年3月获美国加州大学圣地亚哥分校计算机工程博士学位（师从Andrew B. Kahng教授），2024年3月至2025年7月在美国加州大学圣地亚哥分校计算机与电子工程系开展博士后研究。2025年8月加入复旦大学集成芯片与系统全国重点实验室担任助理教授。已在TCAD、ICCAD等期刊与国际会议发表/接收论文20余篇，获ICCAD 2022最佳论文奖、MLCAD 2025最佳论文奖、ACM TODAES亮点文章、MLCAD 2025最佳成果奖、MLCAD Contest 2025总冠军。现任IEEE CEDA DATC委员，担任DAC、DATE、ASP-DAC等国际会议程序委员会成员，担任IEEE TCAD、ACM TODAES等期刊审稿人。教学科研之余积极推动开源社区发展，是开源社区OpenROAD-Research的创始人与维护者。

代表成果

1. C. Lan, H. Pan, Z. Wang*, X. Zeng, F. Yang and K. Zhu*, “PigMap2: A Physical Information Guided Technology Mapping Framework”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2025.

2. A. B. Kahng and Z. Wang, “DG-RePlAce: A Dataflow-Driven GPU-Accelerated Analytical Global Placement Framework for Machine Learning Accelerators”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2024.

3. I. Bustany, A. B. Kahng, I. Koutis, B. Pramanik and Z. Wang, “K-SpecPart: A Supervised Spectral Framework for Multi-Way Hypergraph Partitioning Solution Improvement”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2023.

4. A. B. Kahng, R. Varadarajan and Z. Wang, “Hier-RTLMP: A Hierarchical Automatic Macro Placer for Large-scale Complex IP Blocks”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2023.

5. H. Esmaeilzadeh, S. Ghodrati, A. B. Kahng, J. K. Kim, S. Kinzer, S. Kundu, R. Mahapatra, S. D. Manasi, S. S. Sapatnekar, Z. Wang and Z. Zeng, “An Open-Source ML-Based Full-Stack Optimization Framework for Machine Learning Accelerators”, ACM Transactions on Design Automation of Electronic Systems, 2024. (Paper Highlight)

6. A. Ghose, A. B Kahng, S. Kundu and Z. Wang, “ORFS-agent: Tool-Using Agents for Chip Design Optimization”, Proc. ACM/IEEE International Symposium on Machine Learning for CAD, 2025. (Best Paper Award)

7. V. A. Chhabria, V. Gopalakrishnan, A. B. Kahng, S. Kundu, Z. Wang, B.-Y. Wu and D. Yoon, “Strengthening the Foundations of IC Physical Design and ML EDA Research”, Proc. ACM/IEEE International Conference on Computer-Aided Design, 2024. (Invited Paper)

8. I. Bustany, G. Gasparyan, A. B. Kahng, Y. Koutis, B. Pramanik and Z. Wang, “An Open-Source Constraints-Driven General Partitioning Multi-Tool for VLSI Physical Design”, Proc. ACM/IEEE International Conference on Computer-Aided Design, 2023.

9. I. Bustany, A. B. Kahng, Y. Koutis, B. Pramanik and Z. Wang, “SpecPart: A Supervised Spectral Framework for Hypergraph Partitioning Solution Improvement”, Proc. ACM/IEEE International Conference on Computer-Aided Design, 2022. (Best Paper Award)

10. H. Esmaeilzadeh, S. Ghodrati, J. Gu, S. Guo, A. B. Kahng, J. K. Kim, S. Kinzer, R. Mahapatra, S. D. Manasi, E. Mascarenhas, S. S. Sapatnekar, R. Varadarajan, Z. Wang, H. Xu, B. R. Yatham and Z. Zeng, “VeriGOOD-ML: An Open-Source Flow for Automated ML Hardware Synthesis”, Proc. ACM/IEEE International Conference on Computer-Aided Design, 2021. (Invited Paper)